20 Ahora puede reservar el stock
Cantidad | Precio (sin IVA) |
---|---|
1+ | 79,840 € |
10+ | 72,900 € |
Información del producto
Resumen del producto
Multicomp Typ 400 solder wires have been specially formulated to complement No Clean wave and reflow soldering processes. They are also applicable to repair operations carried out after a cleaning process, eliminating the need for further cleaning. This is designed for users who require a halide free formulation. Multicomp solder wires provide fast soldering on copper and brass surfaces as well as solder coated materials. Activity of the halide activated versions on nickel is also good depending on the state of oxidation of the nickel finish. The good thermal stability of fluxes means they are also well suited to soldering applications requiring high melting temperature alloys.
- Solder wire applicable at repair operations
- Designed for users who require a halide free formulation
- Formulated to complement no clean wave and reflow soldering processes
- Multicomp products are rated 4.6 out of 5 stars
- 12-month limited warranty *view Terms & Conditions for details
- 96% of customers would recommend to a friend
Notas
Lead Free. Material Composition: 99.3% Tin, 0.7% Copper. Rosin based flux, halide activated, normal activation level
Especificaciones técnicas
Sin Plomo
99.3, 0.7 Sn, Cu
0.028"
500g
Multicomp Type 400 Solder Wire
Sin Limpieza, Flux de Colofonia
0.7mm
227°C
1.102lb
No SVHC (14-Jun-2023)
Documentos técnicos (2)
Alternativas para 507-1422
2 productos encontrados
Productos asociados
2 productos encontrados
Legislación y medioambiente
País donde se realizó la mayor parte del proceso de producciónPaís de origen:Germany
País donde se realizó la mayor parte del proceso de producción
RoHS
RoHS
Certificado de conformidad del producto